Symposium and Open House at Bobst Italia 27 – 28 May 2015

Bobst’southward activities in the field of coatings for flexible substrates continue to advance at full speed

New roadways for innovation in press and packagingEss Dee Aluminium and JU host National SeminarOn xx April 2015, Ess Dee Aluminium and Jadavpur University (JU) hosted a one twenty-four hour period National Seminar on innovative application of press in packaging and printed electronics – new trends – at Jadavpur University. S Bandopadhyay, head of the department, Kinesthesia of Technology and Technology, JU; Arved C Hubler, manager, PM TUC at Chemnitz University, Germany; and Ashis Bhattacharya, director, Ess Dee Aluminium addressed the gathering.Ess Dee Aluminium and Jadavpur University hosted a i day National Seminar on innovative awarding of printing in packaging and printed electronics at Jadavpur UniversityThe prime objective of the National Seminar was round tables on new engineering, new trends, new innovations in packaging besides every bit addressing the major concerns of skill and qualified homo resource. The seminar besides highlighted the best global practices for benchmarking, price effectiveness, affordability, surroundings-friendly and greenish technologies. Farther, the sessions were really informative in determining new innovative theories and practical methods whose effectiveness can be measured and must be added to the list of current challenges for today and tomorrow.

"The Indian packaging Industry, which contributes to a large clamper of the manufacturing industry, is expected to grow at 14% CAGR in the next five years and the worldwide trend volition be 5.half-dozen% CAGR growth, with an expected market of Us$ 78 billion. However, an exponential growth volition be witnessed in the Chindonesian region, with Bharat leading the growth trajectory. In view of this paradigm shift, Ess Dee Aluminium and Jadavpur University emancipated this platform to a level of a National Seminar which will offer an first-class opportunity to the future generation to understand the way the manufacture works and also the demand to introduce for survival," said Bhattacharya.

The National Seminar on Innovative Engineering of Printing in Packaging & Printed Electronics served as a platform for stakeholders from around the world to present theories, research findings and special topic sessions to focus on today'due south marketplace challenges and how to innovate to run across the same.

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